Allegro laser systems are used for all processes associated with laser structuring (laser scribing) thin-film solar cells. Whether CIGS, CIS, aSi, aSi/µSi or CdTe, depending on the actual thin-film technology Allegro systems are equipped with the corresponding optimal laser sources and can be equipped for machining from the film- or non-film side of glass. The system modularity accommodates various substrate sizes. The Allegro series combines the ultimate performance and profitability in laser scribing.
The motion of the dynamically optimal component, a compact machining head with multiple parallel machining beams, allows for maximum acceleration and speed to reduce the machining time inside the Laser Scriber. A single machining step simultaneously delivers multiple structures, and substrate handling processes are parallelized to the greatest extent possible. This increases machine output while reducing production costs.
From a construction perspective Allegro laser scribers are rugged, low-maintenance and designed to be easy to maintain: with maintenance-free air bearings for transporting glass and moving the scribing head, long-life laser sources and pre-aligned optical and mechanical components. This effectively reduces scheduled and unscheduled downtimes, increasing system availability.
Optimized machine dynamics, accurate structuring and the minimum-cost machine design make the Allegro laser scriber particularly profitable production equipment for thin-film solar modules.
Maximum module efficiency
The cell with the lowest performance significantly determines the module’s performance. It is therefore important to produce a high-precision pattern with uniform cell size distribution in step P1. The subsequent P2 and P3 lines are accurately aligned and positioned based on this master. An ultra-precision P1 Allegro and the Dynamic Path Tracking in the P2 and P3 Allegros reduce the “dead zone” to maximize module power.
Technical Data: LPKF Allegro Series
||aSi, aSi/nSi, CIS, CIGS, CdTe
||1064 nm, 532 nm or 355 nm
|Laser pulse length
||Picoseconds to nanoseconds
||30 µm – 70 µm (depending on wave length and optical configuration)
||Motor-driven and self-calibrating
||From film- or non-film side of glass
||Multi-beam machining head per customer requirements
||2 mm - 6 mm
||LPKF HighVacuum 500*
OPC server or SECSGem
||Process-integrated quality inspection
Dynamic path tracking
Dynamic focus tracking
* Powerful vacuum extraction and filtration system with filter cleaning, barrel based dust collection optimized for hazardous dusts, HEPA filter optional.