Allegro laser systems are used for all processes associated with laser structuring (laser scribing) thin-film solar cells. Whether CIGS, CIS, aSi, aSi/µSi or CdTe, depending on the actual thin-film technology Allegro systems are equipped with the corresponding optimal laser sources and can be equipped for machining from the film- or non-film side of glass. The building block system accommodates various substrate sizes. The Allegro series combines the ultimate performance and profitability in laser structuring.
Ultimate output

The motion of the dynamically optimal component, a compact machining head with multiple parallel machining beams, allows for maximum acceleration and speed to reduce the machining time inside the Laser Scriber. A single machining step simultaneously delivers multiple structures, and substrate handling processes are parallelized to the greatest extent possible. This increases machine output while reducing production costs.
Maximum module efficiency

The cell with the lowest performance significantly determines the module’s performance. It’s therefore important to produce a high-precision layout with uniform cell size distribution in step P1. The subsequent P2 and P3 lines are accurately aligned and positioned based on this master. An ultra-precision P1 Allegro and the Dynamic Path Tracking in the P2 and P3 Allegros reduce the “dead zone” to maximize module output.
Optimum availability

From a construction perspective Allegro laser scribers are rugged, low-maintenance and designed to be easy to maintain: with maintenance-free air bearings for transporting glass and moving the machining head, long-life laser sources and preset optical and mechanical components. This effectively reduces scheduled and unscheduled non-production times, increasing system availability.
Cost efficiency

Optimized machine dynamics, accurate structuring and the minimum-cost machine design make the Allegro laser scriber particularly profitable production equipment for thin-film solar modules.
Technical Data: LPKF Allegro Series
| Thin-film technologies |
CdTe, aSi, aSi/μSi, CIS, CIGS |
| Laser wavelength |
1064 nm, 532 nm or 355 nm |
| Laser pulse rate |
Picoseconds to nanoseconds |
| Line width |
30 μm – 70 μm (depending on wave length and optical configuration) |
| Line spacing |
Motor-driven and self-calibrating |
| Machining |
From film- or non-film side of glass |
| Machining head |
Multi-beam machining head per customer requirements |
| Substrate size |
Custom |
| Substrate thickness |
2 mm - 6 mm |
| Substrate material |
Float glass |
| Extraction |
LPKF HighVacuum 500* |
| MES Interface |
Customer-specific OPC server or SECSGem |
| Software |
LPKF SolarMaster |
Additional features:
- Process-integrated quality inspection
- Dynamic path tracking
- Dynamic focus tracking
* Powerful vacuum extraction and filtration system with filter cleaning, dust collection inside container and filter- and container replacement optimized for hazardous dust; compatible with optional HEPA filter.